Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

Journal

RSC Advances

Journal Volume

7

Journal Issue

40

Pages

25095-25100

Date Issued

2017

Author(s)

Huang, K.-M.

Tsukamoto, H.

Yong, Y.

Chiu, H.-L.

Nguyen, M.T.

Yonezawa, T.

Liao, Y.-C.

DOI

10.1039/c7ra01005b

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/445959

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85021762700&doi=10.1039%2fc7ra01005b&partnerID=40&md5=a3ed422d017243354c229bedd74db283

Type

journal article