Thermal modeling and device noise properties of 3D-SOI technology

Journal

IEEE Trans. Electron Devices

Journal Volume

54

Journal Issue

4

Date Issued

2009

Author(s)

Tze Wee Chen

Jung Hoon Chun

Yi-Chang Lu

Reza Navid

Wei Wang

Chang-Lee Chen

Robert W. Dutton

YI-CHANG LU

DOI

10.1109/soi.2007.4357866

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/429925

https://www.scopus.com/inward/record.uri?eid=2-s2.0-43549115194&doi=10.1109%2fSOI.2007.4357866&partnerID=40&md5=d8a5196c7d91fe6ed6fb87a073123c18

Type

conference paper