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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Variability of impact life and reliability assessment of electronic packages
Details
Variability of impact life and reliability assessment of electronic packages
Journal
12th Electronics Packaging Technology Conference, EPTC 2010
Date Issued
2010
Author(s)
Hsu, Y.
Wu, W.F.
Su, C.Y.
DOI
10.1109/EPTC.2010.5702748
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/415565
SDGs
[SDGs]SDG12
Type
conference paper
