Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packages

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal Volume

10

Journal Issue

6

Pages

1061-1068

Date Issued

2020

Author(s)

Chen, C.-H.

Lin, Y.-C.

Groth, A.

Lai, Y.-C.

Lin, C.-Y.

Chang, H.-M.

Chuang, T.-H.

TUNG-HAN CHUANG

DOI

10.1109/TCPMT.2020.2988129

URI

https://www.scopus.com/inward/record.url?eid=2-s2.0-85086066293&partnerID=40&md5=e3ae3643a92ca36385a571715c0fb32b

https://scholars.lib.ntu.edu.tw/handle/123456789/546731

SDGs

[SDGs]SDG7

Type

journal article