Non-periodic flipped-SIR EBG for dual-band SSN mitigation in 2-layer PCB

Journal

2018 IEEE Electrical Design of Advanced Packaging and Systems

Date Issued

2018

Author(s)

Y.-C. Wang

H.-W. Chan

H.-C. Hsieh

Y.-H. Lin

W.-S. Wang

S.-H. Wang

R.-B. Wu

DOI

10.1109/edaps.2018.8680868

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/427885

Type

conference paper