Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits,
Details
Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits,
Journal
IEEE 3D IC Test workshop
Date Issued
2012-01
Author(s)
CHIEN-MO LI
C.Y. Kuo
C. J. Shih
J. C. M. Li
K. Chakrabarty
CHIEN-MO LI
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/374350
Type
conference paper