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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Novel method for in-situ monitoring of thickness of silicon wafer during wet etching
Details
Novel method for in-situ monitoring of thickness of silicon wafer during wet etching
Journal
Sensors and Materials
Journal Volume
18
Journal Issue
2
Pages
71-82
Date Issued
2006
Author(s)
LEE, CY
CHANG, PZ
CHEN, YY
et al.
PING-HEI CHEN
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/322320
Type
journal article
