Optimization of TSV Array Based on Mathematical Model for HBM3
Part Of
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024
Start Page
1
End Page
3
ISBN (of the container)
979-835035123-1
Date Issued
2024-10-06
Author(s)
Event(s)
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024
Publisher
IEEE
Type
conference paper