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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
Pre-bond characterization of 1-bit/stage pipelined ADC for 3D-IC applications
Details
Pre-bond characterization of 1-bit/stage pipelined ADC for 3D-IC applications
Journal
Asian Test Symposium
Pages
284-289
Date Issued
2012-11
Author(s)
Y.-H. Chou
J.-L. Huang
X.-L. Huang
JIUN-LANG HUANG
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/374332
Type
conference paper