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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
Thermal-aware Test scheduling for 3D ICs
Details
Thermal-aware Test scheduling for 3D ICs
Journal
IEEE Int’l 3D IC Test Workshop
Date Issued
2011-01
Author(s)
CHIEN-MO LI
CY Hsu
JCM Li
K. Chakrbarty
CHIEN-MO LI
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/366787
Type
conference paper