Electromigration induced metal dissolution in flip-chip solder joints

Journal

Materials Science Forum

Journal Volume

475-479

Journal Issue

IV

Pages

2655-2658

Date Issued

2005

Author(s)

Lin Y.H.

Tsai C.M.

Hu Y.C.

Lin Y.L.

Tsai J.Y.

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-17044413733&partnerID=40&md5=b0659801f3f122318f9736e6e6e10a7f

https://scholars.lib.ntu.edu.tw/handle/123456789/432714

Type

conference paper