Thermal-driven analog placement considering device matching.
Journal
Proceedings of the 46th Design Automation Conference, DAC 2009, San Francisco, CA, USA, July 26-31, 2009
Pages
593-598
Date Issued
2009
Author(s)
Abstract
With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works. Copyright 2009 ACM.
SDGs
Type
conference paper