Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Electrical Engineering and Computer Science / 電機資訊學院
Communication Engineering / 電信工程學研究所
Thermal-driven analog placement considering device matching.
Details
Thermal-driven analog placement considering device matching.
Journal
Proceedings of the 46th Design Automation Conference, DAC 2009, San Francisco, CA, USA, July 26-31, 2009
Pages
593-598
Date Issued
2009
Author(s)
Lin, Mark Po-Hung
Zhang, Hongbo
Wong, Martin D. F.
YAO-WEN CHANG
DOI
10.1145/1629911.1630064
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/501989
URL
https://doi.org/10.1145/1629911.1630064
SDGs
[SDGs]SDG7
Type
conference paper