Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

Journal

4th International Symposium on Electronic Materials and Packaging 2002

Pages

330-334

ISBN

078037682X

9780780376823

Date Issued

2002

Author(s)

Luo W.-C.

DOI

10.1109/EMAP.2002.1188860

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966667353&doi=10.1109%2fEMAP.2002.1188860&partnerID=40&md5=899c03274b9faad27195bb1b6fbc0ded

https://scholars.lib.ntu.edu.tw/handle/123456789/432730

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper