Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure
Journal
Scripta Materialia
Journal Volume
214
Date Issued
2022
Author(s)
Abstract
Synchrotron X-ray analysis of the Sn electromigration behavior and Sn whisker growth in a Blech structure using nano-X-ray fluorescence microscopy and white beam Laue nanodiffraction was conducted. Sn depletion at the cathode and whisker/extrusion formation at the anode were characterized in-situ, and the results obeyed the electromigration kinetics. This electromigration scenario gradually decayed because of the counterbalance between electron wind force and back stress. White beam Laue nanodiffraction analysis showed that a noticeable compressive deviatoric stress in the direction of electron flow built up at the anode of Sn strips, particularly in the roots of Sn whiskers, confirming that electromigration-induced atomic accumulation occurred downstream in a strip and that Sn whiskering was closely related to internal stress resulting from atomic accumulation in confined segments. Finally, a theoretical model based on fundamental electromigration theory revealed that Sn diffused predominately through lattice and grain boundary paths at Sn homologous temperature of 0.6. © 2022 Acta Materialia Inc.
Subjects
Electromigration; Laue diffraction; Nano X-ray fluorescence; Sn whiskers; Synchrotron radiation
Other Subjects
Anodes; Electromigration; Fluorescence; Fluorescence microscopy; Grain boundaries; Lattice theory; Synchrotrons; X ray powder diffraction; Growth strain; Laue diffraction; Nano X-ray fluorescence; Nanodiffraction; Residual strain evolution; Sn whisker; Whisker growth; White beams; X ray fluorescence; X-ray studies; Synchrotron radiation
Type
journal article