Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing
Journal
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Journal Volume
45
Journal Issue
12
Pages
5574-5583
Date Issued
2014
Author(s)
Abstract
Ag-4Pd binary alloy wire has been produced as an alternative to a previously developed Ag-8Au-3Pd ternary alloy wire to meet requirements for high electrical conductivity and low cost. The electrical resistivity of this Ag-4Pd bonding wire, manufactured with a conventional method, is 3.7 μΩ cm, close to the values of traditional 3N Au wire (3.5 μΩ cm) and Pd-coated Cu wire (1.8 μΩ cm). To further improve the performance of this bonding wire, a large amount of annealing twins were introduced in this Ag-4Pd alloy wire through an innovative concept of sequential drawing and multiple annealing processes. The resulting electrical resistivity of this annealing-twinned Ag-4Pd wire is 3.5 μΩ cm. In contrast to the apparent increase in grain size in the conventional Ag-4Pd wire under electrical stressing with a current density of 1.23 × 105 A/cm2 for various times, the grains in this annealing-twinned wire grow much more slowly. The breaking load and elongation of this annealing-twinned Ag-4Pd wire are also higher than those of conventional wire. Furthermore, annealing twins increase the durability to electromigration of this Ag-4Pd wire under electrical stressing with various current densities.
Type
journal article