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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Investigation of defects in ultra-thin Al 2 O 3 films deposited on pure copper by the atomic layer deposition technique
Details
Investigation of defects in ultra-thin Al 2 O 3 films deposited on pure copper by the atomic layer deposition technique
Journal
Applied Surface Science
Journal Volume
359
Pages
533-542
Date Issued
2015
Author(s)
Chang M.L.
Wang L.C.
Lin H.C.
Chen M.J.
Lin K.M.
DOI
10.1016/j.apsusc.2015.10.144
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84961782222&doi=10.1016%2fj.apsusc.2015.10.144&partnerID=40&md5=80df6b9520e44fa5fa423f7d99eef473
https://scholars.lib.ntu.edu.tw/handle/123456789/432421
Publisher
Elsevier B.V.
Type
journal article