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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Thermal-Cyclic Fatigue Reliability Analysis of Electronic Packages based on Probabilistic Design Concept
Details
Thermal-Cyclic Fatigue Reliability Analysis of Electronic Packages based on Probabilistic Design Concept
Journal
The 6th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering
Date Issued
2011
Author(s)
Su, C.Y.
Wu, W.F.
Hsu, Y.
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/415564
Type
conference paper