Bonding of Copper Pillars Using Electroless Cu Plating

Journal

2019 International Conference on Electronics Packaging

Pages

220-222

ISBN

9784990218867

Date Issued

2019

Author(s)

Kao L.Y.

Hung H.T.

Chen Y.H.

DOI

10.23919/ICEP.2019.8733511

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85068346387&doi=10.23919%2fICEP.2019.8733511&partnerID=40&md5=1b9e5f584ec0fda41c4f6d7630e3cd9b

https://scholars.lib.ntu.edu.tw/handle/123456789/432564

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper