https://scholars.lib.ntu.edu.tw/handle/123456789/432564| Title: | Bonding of Copper Pillars Using Electroless Cu Plating | Authors: | Kao L.Y. Hung H.T. Chen Y.H. Kao C.R. C. ROBERT KAO |
Issue Date: | 2019 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Start page/Pages: | 220-222 | Source: | 2019 International Conference on Electronics Packaging | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85068346387&doi=10.23919%2fICEP.2019.8733511&partnerID=40&md5=1b9e5f584ec0fda41c4f6d7630e3cd9b https://scholars.lib.ntu.edu.tw/handle/123456789/432564 |
ISBN: | 9784990218867 | DOI: | 10.23919/ICEP.2019.8733511 |
| Appears in Collections: | 材料科學與工程學系 |
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