Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates
Resource
Zeitschrift fur Metallkunde 93: 248-252
Journal
Zeitschrift fur Metallkunde 93:
Pages
248-252
Date Issued
2002
Date
2002
Author(s)
Chiu, M. Y.
Chang, S. Y.
Tseng, Y. H.
Chan, Y. C.
Chuang, T. H.
Type
journal article