Viscoelastic stress relaxation in film/substrate systems - Kelvin model
Journal
Journal of Applied Physics
Journal Volume
93
Journal Issue
5
Pages
2453-2457
Date Issued
2003
Author(s)
Abstract
An analytical model was developed to study the viscoelastic stress relaxation in film/substrate systems. The viscous flow was assumed to follow the Kelvin model, and the viscoelastic solution was obtained from existing elastic solution using Laplace transform. Results indicated that the stress relaxation rate increased with decreased film-to-substrate thickness ratio.
Type
journal article