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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics
Details
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics
Journal
Microelectronics Reliability
Journal Volume
53
Journal Issue
1
Pages
47-52
Date Issued
2013
Author(s)
Chen Y.J.
Chung C.K.
Yang C.R.
C. ROBERT KAO
DOI
10.1016/j.microrel.2012.06.116
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872098975&doi=10.1016%2fj.microrel.2012.06.116&partnerID=40&md5=4b76c46ff89f645cd5544205b9a8b653
https://scholars.lib.ntu.edu.tw/handle/123456789/432632
Type
journal article