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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
A chip-package-board co-design methodology
Details
A chip-package-board co-design methodology
Journal
Design Automation Conference
Pages
1082-1087
Date Issued
2012
Author(s)
Lee, H.-C.
YAO-WEN CHANG
DOI
10.1145/2228360.2228557
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-84863543753&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/372710
Type
conference paper