Effect of parametric randomness on reliability analysis of wafer-level chip-scale packages

Journal

2008 10th International Conference on Electronic Materials and Packaging

Pages

297-300

ISBN

9781424436217

Date Issued

2008

Author(s)

Hsu T.-K.

Su C.-Y.

Chen Y.-C.

Yao H.

DOI

10.1109/EMAP.2008.4784287

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049117959&doi=10.1109%2fEMAP.2008.4784287&partnerID=40&md5=9c75cd6883b4c640ceb235e83c684de8

https://scholars.lib.ntu.edu.tw/handle/123456789/415025

Type

conference paper