Freestanding Microheaters in Si with High Aspect Ratio Microstructures
Journal
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Journal Volume
20
Journal Issue
3
Pages
1008-1012
Date Issued
2002-05
Author(s)
WEI-CHENG TIAN
S. W. Pang
Abstract
The development of thick microheaters from freestanding and high aspect ratio microstructures by micromachining of Si was reported. Dry etching and passivation produced 240μm thick microheaters with 3μm wide wires, and an aspect ratio of 80:1 was achieved. The heating response of the microheaters was also studied. A similar response time and heating was shown by microheaters consisting of wires and posts. Results showed that power consumption was reduced by thermal isolation of the microheaters. The obtained microheaters had high power efficiency, large adsorbent capacity and high mechanical strength.
SDGs
Type
journal article
