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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Effects of Ti addition to Sn–Ag and Sn–Cu solders
Details
Effects of Ti addition to Sn–Ag and Sn–Cu solders
Resource
Journal of Alloys and Compounds, 520, 244-249
Journal
Journal of Alloys and Compounds
Journal Issue
520
Pages
244-249
Date Issued
2012
Date
2012
Author(s)
Chen, W.M.
Kang, S.K.
C. ROBERT KAO
DOI
10.1016/j.jallcom.2012.01.032
URI
https://www.scopus.com/record/display.uri?eid=2-s2.0-84862825280&origin=resultslist&sort=plf-f&src=s&sid=8cb953b3aa70a701e586a8160ace9e85&sot=b&sdt=b&s=TITLE-ABS-KEY%28Effects+of+Ti+addition+to+Sn%E2%80%93Ag+and+Sn%E2%80%93Cu+solders%29&sl=64&sessionSearchId=8cb953b3aa70a701e586a8160ace9e85&relpos=9
Type
journal article
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Name
39.pdf
Size
23.44 KB
Format
Adobe PDF
Checksum
(MD5):3767870abaa73e7af26fdfe7a8974ae7
