Effects of Ti addition to Sn–Ag and Sn–Cu solders

Resource

Journal of Alloys and Compounds, 520, 244-249

Journal

Journal of Alloys and Compounds

Journal Issue

520

Pages

244-249

Date Issued

2012

Date

2012

Author(s)

Chen, W.M.

Kang, S.K.

C. ROBERT KAO

DOI

10.1016/j.jallcom.2012.01.032

URI

https://www.scopus.com/record/display.uri?eid=2-s2.0-84862825280&origin=resultslist&sort=plf-f&src=s&sid=8cb953b3aa70a701e586a8160ace9e85&sot=b&sdt=b&s=TITLE-ABS-KEY%28Effects+of+Ti+addition+to+Sn%E2%80%93Ag+and+Sn%E2%80%93Cu+solders%29&sl=64&sessionSearchId=8cb953b3aa70a701e586a8160ace9e85&relpos=9

Type

journal article