Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode

Journal

Journal of Materials Engineering and Performance

Journal Volume

22

Journal Issue

7

Pages

2029-2037

Date Issued

2013

Author(s)

Yang, C.L.

Lai, H.J.

Hwang, J.D.

TUNG-HAN CHUANG

DOI

10.1007/s11665-013-0487-1

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491979

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84879500495&doi=10.1007%2fs11665-013-0487-1&partnerID=40&md5=8e40bbf35374fb5d4d2df7a0f7e165a6

Type

conference paper