Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integration
Journal
IEEE Transactions on Microwave Theory and Techniques
Journal Volume
60
Journal Issue
3 PART 2
Pages
766-777
Date Issued
2012
Author(s)
Lu, H.-C.
Kuo, C.-C.
Lin, P.-A.
Tai, C.-F.
Chang, Y.-L.
Jiang, Y.-S.
Tsai, J.-H.
Hsin, Y.-M.
Type
journal article