Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages

Journal

4th International Symposium on Electronic Materials and Packaging 2002

Pages

324-329

ISBN

078037682X

9780780376823

Date Issued

2002

Author(s)

Lin Y.L.

Tsai J.

DOI

10.1109/EMAP.2002.1188859

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-45449117403&doi=10.1109%2fEMAP.2002.1188859&partnerID=40&md5=13ccdaefa49852a2924a8d17cf063067

https://scholars.lib.ntu.edu.tw/handle/123456789/432733

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper