The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction
Journal
Scripta Materialia
Journal Volume
65
Journal Issue
4
Pages
331-334
Date Issued
2011
Author(s)
Abstract
The preferred orientation growth of intermetallic compounds is becoming an increasingly important issue, due to recent advances in three-dimensional integrated circuits. This study reveals that Cu6Sn5 that is formed on Ni does not grow in random orientations, but exhibits a pronounced preferred orientation relationship. This relationship is identified as (12̄0)(Cu,Ni)6Sn5(11̄1)Niand[001](Cu, Ni)6Sn5[110]Ni, according to electron backscatter diffraction and high-resolution transmission electron microscopy analysis. One critical implication is that no Ni3Sn4 exists between Cu6Sn5 and Ni because the Cu 6Sn5/Ni interface is coherent. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Type
journal article