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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction
Details
The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction
Journal
Scripta Materialia
Journal Volume
65
Journal Issue
4
Pages
331-334
Date Issued
2011
Author(s)
Chen W.M.
Yang T.L.
Chung C.K.
C. ROBERT KAO
DOI
10.1016/j.scriptamat.2011.04.034
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-79958191484&doi=10.1016%2fj.scriptamat.2011.04.034&partnerID=40&md5=b28fc8bb07988b7cd6578c61c3774228
https://scholars.lib.ntu.edu.tw/handle/123456789/432645
Type
journal article
