Mechanical behavior of flip chip packages under thermal loading

Resource

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Journal

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Pages

-

Date Issued

2005-06

Date

2005-06

Author(s)

Chen, Shoulung

Tsai, C.Z.

Kao, Nicholas

Wu, Enboa

DOI

10.1109/ECTC.2005.1442017

DOI

0569-5503

URI

http://ntur.lib.ntu.edu.tw//handle/246246/200704191001150

Type

other

File(s)

Name

01442017.pdf

Size

430.73 KB

Format

Adobe PDF

Checksum

(MD5):855122b3ab244e70e3606f9c3722b4fd