Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

Journal

Journal of Electronic Materials

Journal Volume

28

Journal Issue

11

Pages

1231-1237

Date Issued

1999

Author(s)

Ho C.E.

Chen Y.M.

DOI

10.1007/s11664-999-0162-3

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0033221504&doi=10.1007%2fs11664-999-0162-3&partnerID=40&md5=800c2c02ac59008364e80d525103cd70

https://scholars.lib.ntu.edu.tw/handle/123456789/432749

Publisher

Minerals, Metals & Materials Soc (TMS), Warrendale

Type

journal article