Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires
Journal
Journal of Electronic Materials
Journal Volume
41
Journal Issue
11
Pages
3215-3222
Date Issued
2012
Author(s)
Abstract
An innovative Ag-8Au-3Pd bonding wire containing a large amount of annealing twins has been produced. In contrast to the apparent grain growth in a conventional Ag-8Au-3Pd wire during aging at 600°C, the grain size of this annealing-twinned Ag alloy wire remains almost unchanged. The high thermal stability of the grain structure leads to a smaller heat-affected zone near the free air ball of this twinned wire. The annealing twins in this material also result in the dual merits of increased tensile strength and elongation with aging time, which is beneficial for the reliability of wirebonded packages. © 2012 TMS.
Type
journal article