Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires

Journal

Journal of Electronic Materials

Journal Volume

41

Journal Issue

11

Pages

3215-3222

Date Issued

2012

Author(s)

Chuang, T.-H.

Tsai, C.-H.

Wang, H.-C.

Chang, C.-C.

Chuang, C.-H.

Lee, J.-D.

Tsai, H.-H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-012-2225-0

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491985

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84868531118&doi=10.1007%2fs11664-012-2225-0&partnerID=40&md5=b626f835d7148493ff0596ccff857740

Type

journal article