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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
電子封裝體之熱疲勞壽命變異分析與可靠度評估
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電子封裝體之熱疲勞壽命變異分析與可靠度評估
Journal
中華民國第八屆可靠度與維護度技術研討會
Date Issued
2009
Author(s)
徐堯
吳文方
許登凱
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/415590
Type
conference paper
