https://scholars.lib.ntu.edu.tw/handle/123456789/415590| Title: | 電子封裝體之熱疲勞壽命變異分析與可靠度評估 | Authors: | 徐堯 吳文方 許登凱 |
Issue Date: | 2009 | Source: | 中華民國第八屆可靠度與維護度技術研討會 | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/415590 |
| Appears in Collections: | 機械工程學系 |
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