Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads

Journal

Journal of Materials Engineering and Performance

Journal Volume

18

Journal Issue

2

Pages

211-215

Date Issued

2009

Author(s)

Jain, C. C.

STEVEN SHENG-SHIH WANG

Huang, K. W.

TUNG-HAN CHUANG

DOI

10.1007/s11665-008-9292-7

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/445796

Type

journal article