Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

12

Pages

2147-2153

Date Issued

2006

Author(s)

Lin Y.L.

Lai Y.S.

Tsai C.M.

DOI

10.1007/s11664-006-0325-4

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33846430875&doi=10.1007%2fs11664-006-0325-4&partnerID=40&md5=830dbe8dd33443e75fde1351c2287f8f

https://scholars.lib.ntu.edu.tw/handle/123456789/432700

Type

conference paper