Publication:
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Date

2006

Authors

Lin Y.L.

C. ROBERT KAO;Kao C.R.;Tsai C.M.;Lai Y.S.;Lin Y.L.

Lai Y.S.

Tsai C.M.

C. ROBERT KAO

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33846430875&doi=10.1007%2fs11664-006-0325-4&partnerID=40&md5=830dbe8dd33443e75fde1351c2287f8f
https://scholars.lib.ntu.edu.tw/handle/123456789/432700

Collections

Materials Science and Engineering / 材料科學與工程學系