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A Smart CMOS Assay SoC for Rapid Blood Screening Test of Risk Prediction

Journal
IEEE Transactions on Biomedical Circuits and Systems
Journal Volume
9
Journal Issue
6
Pages
790-800
Date Issued
2015
Author(s)
Kuo, Po-Hung
Kuo, Jui-Chang
Hsueh, Hsiao-Ting
Hsieh, Jian-Yu
Huang, Yi-Chun
Wang, Tao
YEN-HUNG LIN  
Lin, Chih-Ting
Yang, Yao-Joe
YAO-JOE YANG 
CHIH-TING LIN 
DOI
10.1109/TBCAS.2015.2507618
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84955125498&doi=10.1109%2fTBCAS.2015.2507618&partnerID=40&md5=57219280837381660f5fea49d94a5fda
https://scholars.lib.ntu.edu.tw/handle/123456789/527678
Abstract
Rapid blood test is essential to disease control, risk assessment and point-of-care testing. Conventional enzyme-linked immunosorbent assay (ELISA) requires several hours or even days to get meaningful results. However, to some fierce contagious diseases, such as Ebola and SARS, the contagion can spread so fast that an instant and massive screening test is needed. A CMOS assay system-on-chip (SoC) offering a fast and cheap disease screening tool can be very helpful in the place where the medical resources are limited and the test is too costly to afford. Unlike the previously proposed CMOS biomolecular detection based on direct detection [1], a sandwiched assay detection protocol is adopted in this work, which possesses high sensitivity, high specificity and is free from pre-purified antigen process. As shown in Figure 1, a human blood sample containing the target biomolecules is applied on the proposed SoC. The test procedure includes blood filtration, biomolecular conjugation, electrolytic pumping, magnetic flushing and detection, automatically controlled by a micro-controller unit (MCU). The biomolecular signal is converted to the electrical signal by a CMOS-based Hall sensor array, as shown in the SEM image of Fig. 21.6.1, where the surface is coated with biomolecular probe. With the integration of the four LEDs and a battery, the detection steps can be indicated, providing an easy self-test point-of-care application.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Type
conference paper

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