Low temperature direct electroless nickel plating on silicon wafer

Journal

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Journal Volume

32

Journal Issue

1

Pages

137-140

Date Issued

2009

Author(s)

Jain, C.-C.

Wang, S.-S.

Chuang, T.-H.

Yang, S.-R.

DOI

URI

URL

Type

journal article