Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish
Journal
2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference
Pages
53-56
ISBN
9781424436248
Date Issued
2008
Author(s)
Abstract
We report in this work the effect of multiple reflow cycles on ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on Sn-4Ag-0.5 Cu solder joints. Solder balls were mounted on Cu substrate pads with immersion tin surface finish, supplied by two vendors. For these particular test vehicles and test conditions, fracture near the interface between the interfacial Cu 6 Sn 5 intermetallic compound (IMC) and Cu pad was identified as the only failure mode induced by BIT. Measurement results indicate that BIT characteristics in general degrade as the number of reflow cycles increases. Furthermore, scanning electron microscopy observations show that the thickness and grain size of interfacial Cu 6 Sn 5 increase with increasing number of reflow cycles. This correlation confirms the familiar notion that a thicker Cu 6 Sn 5 degrades the interfacial strength.
Type
conference paper