https://scholars.lib.ntu.edu.tw/handle/123456789/432685| Title: | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | Authors: | Lail Y.-S. Kao C.R. Chang H.-C. Lee S.-H. Kao C.-L. Lan W.-H. C. ROBERT KAO |
Issue Date: | 2008 | Start page/Pages: | 53-56 | Source: | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049103988&doi=10.1109%2fIMPACT.2008.4783806&partnerID=40&md5=b4411409dded19125d9c95ee98af7f69 https://scholars.lib.ntu.edu.tw/handle/123456789/432685 |
ISBN: | 9781424436248 | DOI: | 10.1109/IMPACT.2008.4783806 |
| Appears in Collections: | 材料科學與工程學系 |
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