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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Full-wave characterization of a through hole via in multi-layered packaging
Details
Full-wave characterization of a through hole via in multi-layered packaging
Journal
IEEE Transactions on Microwave Theory and Techniques
Journal Volume
43
Journal Issue
5
Pages
1073-1081
Date Issued
1995
Author(s)
Hsu, S. G.
Wu, Ruey-Beei
DOI
10.1109/22.382068
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/317552
Type
journal article
