Ultra-high light extraction efficiency and ultra-thin mini-LED solution by freeform surface chip scale package array
Journal
Crystals
Journal Volume
9
Journal Issue
4
Date Issued
2019
Author(s)
Abstract
In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array. © 2019 by the authors. Licensee MDPI, Basel, Switzerland.
Subjects
Chip scale package; Freeform design; Light emitting diode; Mini LED
SDGs
Type
journal article