https://scholars.lib.ntu.edu.tw/handle/123456789/632161
標題: | Ultra-high light extraction efficiency and ultra-thin mini-LED solution by freeform surface chip scale package array | 作者: | Huang C.-H Kang C.-Y Chang S.-H Lin C.-H Lin C.-Y Wu T Sher C.-W CHIEN-CHUNG LIN Lee P.-T Kuo H.-C. |
關鍵字: | Chip scale package; Freeform design; Light emitting diode; Mini LED | 公開日期: | 2019 | 卷: | 9 | 期: | 4 | 來源出版物: | Crystals | 摘要: | In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array. © 2019 by the authors. Licensee MDPI, Basel, Switzerland. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85065917473&doi=10.3390%2fcryst9040202&partnerID=40&md5=e7b076c4111371bb97fe05db950cf106 https://scholars.lib.ntu.edu.tw/handle/123456789/632161 |
ISSN: | 20734352 | DOI: | 10.3390/cryst9040202 |
顯示於: | 電機工程學系 |
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