Electron Mobility Enhancement in GeSn n-Channel MOSFETs by Tensile Strain
Journal
IEEE Electron Device Letters
Journal Volume
42
Journal Issue
1
Pages
10-13
Date Issued
2021
Author(s)
Abstract
A record high electron mobility of 698 cm2/ Vcs in a tensile-strained Ge0.96Sn0.04 nMOSFET is demonstrated in this letter. High-quality GeSn films were epitaxially grown by lowerature chemical vapor deposition. Different strain conditions in the active GeSn layers were achieved by Ge or GeSn relaxed buffers. A mesa FET structure was used to effectively reduce the OFF leakage by a recessed p/n junction in Ge. The ION/IOFF ratio in the mesa GeSn FETs is boosted by a factor of 100 compared to conventional planar devices. As the GeSn film becomes more tensile strained, the channel mobility is enhanced, which could be attributed to a higher carrier population in the Γ valley. ? 1980-2012 IEEE.
Subjects
Chemical vapor deposition; Electron mobility; Hall mobility; Hole mobility; MOSFET devices; Semiconductor alloys; Tensile strain; Carrier population; Channel mobility; Epitaxially grown; High electron mobility; Mobility enhancement; Planar devices; Relaxed buffer; Strain conditions; Tin alloys
Type
journal article